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Thumbnail Name Type Author Updated Sort ascending
The Trip to Spain Poster Image wcollins37
Hazardous Materials Image Josh Brown
Promised Land Poster Image wcollins37
Home Depot Interns staying at Georgia Tech Image Sravanthi Meka
Hostiles Poster Image wcollins37
Super Dark Times Poster Image wcollins37
In the Fade Poster Image wcollins37
Please Stand By Poster Image wcollins37
Dear Dictator Poster Image wcollins37
All.I.Can Poster Image wcollins37
runner next to the stamps health services building Healthy Jackets Summer Challenge Image Jessica Kolis
Andrea Welsh Image A. Maureen Rouhi
SHIELD - Diagram: Secure Heterogeneous Image Ensemble with Localized Denoising SHIELD - Diagram: Secure Heterogeneous Image Ensemble with Localized Denoising Image Kristen Perez
Henry Shi, OMSCS alumnus and co-founder of SnapTravel Henry Shi - SnapTravel Image Brittany Aiello
cadets outside the campanile Cadets Image Georgia Parmelee
photograph of Muhammad Amir Shafiq Muhammad Amir Shafiq Image Jackie Nemeth
photograph of Motaz Alfarraj Motaz Alfarraj Image Jackie Nemeth
photograph of Adrian Ildefonso Adrian Ildefonso Image Jackie Nemeth
Ravi Subramanian and Basak Kalkanci Image Josh Brown
Sebastian Pokutta in his lab Big data Image Georgia Parmelee
McMillan Sidewalk Closure Image svalkenburgh3
Image of bacterial biofilm showing wound model Bacterial biofilm Image John Toon
Studying bacterial behavior in the lab versus in humans Studying bacterial behavior Image John Toon
Studying bacterial behavior in the lab versus in humans Studying bacterial behavior2 Image John Toon
Han Solo Han Solo Image Jason Maderer
photograph of Matthieu Bloch Matthieu Bloch Image Jackie Nemeth
How to Afford Study Abroad Flyer for fall 2018 How to Afford Study Abroad Flyer for fall 2018 Image Ashlee Flinn
photograph of Muneeb Zia and Rabia Zia, pictured left to right Muneeb Zia and Rabia Zia, pictured left to right Image Jackie Nemeth
CODA building rendering Image svalkenburgh3
photograph of Kristine Nagel Kristine Nagel Image Jackie Nemeth
Lena Ting, professor in the Wallace H. Coulter Department of Biomedical Engineering at Emory and Georgia Tech Lena Ting, professor in the Wallace H. Coulter Department of Biomedical Engineering at Emory and Georgia Tech Image Walter Rich
Two dogs fetch Double-fetch bug Image Tess Malone
Fall 2018 LGBTQIA Study Abroad Info. Session Flyer Fall 2018 LGBTQIA Info. Session Flyer Image Ashlee Flinn
well-being Image Christine Kapurch
Cassie Mitchell, assistant professor in the Wallace H. Coulter Department of Biomedical Engineering at Georgia Tech and Emory. Cassie Mitchell, Ph.D. Image Walter Rich
Joshua Weitz Image A. Maureen Rouhi
Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Image cheath6
Meet Astronaut Lawrence DeLucas Image A. Maureen Rouhi
Figure 5. (b) composite metal foams Figure 5. (b) composite metal foams Image cheath6
Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Image cheath6
Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Image cheath6
Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Image cheath6
Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Image cheath6
Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness 1 mm) vs. copper plated PCB (total thickness 1 mm) Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm) Image cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Image cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Figure 1. New innovations in thermal management of high-density glass packages. Image cheath6
Taesik Na and Jong Hwan Ko are pictured at the center Taesik Na and Jong Hwan Ko (center) Image Jackie Nemeth
BME trophies Image Jerry Grillo
Robert Lee Image Jerry Grillo
BME award winners Image Jerry Grillo