{"246001":{"#nid":"246001","#data":{"type":"event","title":"Global Interposer Technology Workshop (GIT 2013)","body":[{"value":"\u003Cp\u003EYou are cordially invited to the\u003Ca href=\u0022http:\/\/www.prc.gatech.edu\/git2013\/\u0022\u003E\u0026nbsp;\u003Cstrong\u003EGIT 2013 Workshop\u003C\/strong\u003E\u003C\/a\u003E\u003Cstrong\u003E,\u003C\/strong\u003E which is intended to stimulate the development of the most advanced semiconductor and systems packaging\u0026nbsp;technologies, with interposer experts comparing and contrasting a wide variety of interposer technologies such as silicon, organic, and glass.\u003C\/p\u003E\u003Cp\u003EGIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. These leading-edge interposer technologies have many applications including in the packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive and high performance systems.\u003C\/p\u003E\u003Cp\u003EGIT 2013 will focus on Interposer Technology with an expanded 2 1\/2-day agenda including:\u003C\/p\u003E\u003Cp\u003E* Plenary Talks from Industry and Academic Experts\u003C\/p\u003E\u003Cp\u003E* Technical Sessions and Talks on\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EHigh Performance \u0026amp; Mobil Systems\u003C\/li\u003E\u003Cli\u003ESilicon Interposers: Foundry, OSAT and Research\u003C\/li\u003E\u003Cli\u003EOrganic Interposers and Packages: User, Manufacturer, Research and Supply Chain Perspectives\u003Cbr \/\u003E\u003C\/li\u003E\u003Cli\u003EGlass Interposers and Interconnections: Research, Application, Manufacturing Perspective\u003C\/li\u003E\u003Cli\u003EGlass Panel Manufacturing and Glass Interposer Manufacturing Instructure\u003C\/li\u003E\u003Cli\u003EAnalog and Embeddded Packaging\u003C\/li\u003E\u003Cli\u003EDesign: Electrical, Thermal and Mechanical\u003C\/li\u003E\u003Cli\u003EMarkets and Applications\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003E* Interactive Poster Session (Best Poster Paper Awards)\u003C\/p\u003E\u003Cp\u003E* Networking opportunities with more than 150 System Packaging and Technology Experts\u003C\/p\u003E\u003Cp\u003E* GIT 2013 Grand Reception - Historic Academy of Medicine\u003C\/p\u003E\u003Cp\u003EGIT 2013 Kicks off Sunday, November 17 with The\u0026nbsp;\u003Cstrong\u003E\u003Ca href=\u0022http:\/\/www.prc.gatech.edu\/git2013\/golf.html\u0022\u003E1st Annual GIT Golf Classic\u003C\/a\u003E\u003C\/strong\u003E\u0026nbsp;at The Landing Course, Reynolds Plantation, Greensboro, Georgia,\u0026nbsp;\u003Cem\u003E\u0022The Landing is the hidden gem of Lake Oconee. Bob Cupp\u0027s architectural genius was unveiled to the golfing world during the construction of Reynolds Landing. From the masterful green settings to the challenging shots played around beautiful Lake Oconee, The Landing is clearly one of Georgia\u0027s finest kept secrets.\u0022\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003ECosts include: Transportation to and from the Georgia Tech Learning Center, greens fees, timed starts, and brunch. Best ball and longest drive awards will be recognized for the day!\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EGIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. These leading-edge interposer technologies have many applications including in the packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive and high performance systems.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Global Semiconductor and System Technology Leaders to Debate Future of Electronics for Smart Systems, R\u0026D and Manufacturing at GIT 2013"}],"uid":"27863","created_gmt":"2013-10-15 15:37:24","changed_gmt":"2016-10-08 02:05:16","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2013-11-17T08:00:00-05:00","event_time_end":"2013-11-20T11:00:00-05:00","event_time_end_last":"2013-11-20T11:00:00-05:00","gmt_time_start":"2013-11-17 13:00:00","gmt_time_end":"2013-11-20 16:00:00","gmt_time_end_last":"2013-11-20 16:00:00","rrule":null,"timezone":"America\/New_York"},"extras":["free_food"],"hg_media":{"245101":{"id":"245101","type":"image","title":"GIT 2013 Logo Sm","body":null,"created":"1449243722","gmt_created":"2015-12-04 15:42:02","changed":"1475894921","gmt_changed":"2016-10-08 02:48:41","alt":"GIT 2013 Logo Sm","file":{"fid":"197894","name":"git_2013_logo_sm.jpg","image_path":"\/sites\/default\/files\/images\/git_2013_logo_sm_0.jpg","image_full_path":"http:\/\/tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/git_2013_logo_sm_0.jpg","mime":"image\/jpeg","size":34444,"path_740":"http:\/\/tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/git_2013_logo_sm_0.jpg?itok=Dj0LkTua"}}},"media_ids":["245101"],"groups":[{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"}],"categories":[],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"77071","name":"GIT 2013"},{"id":"77061","name":"glass packaging"},{"id":"69571","name":"Interposers"},{"id":"6593","name":"organic semiconductors"},{"id":"167855","name":"silicon wafer"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1789","name":"Conference\/Symposium"},{"id":"1795","name":"Seminar\/Lecture\/Colloquium"},{"id":"26411","name":"Training\/Workshop"}],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}