<node id="269151">
  <nid>269151</nid>
  <type>external_news</type>
  <uid>
    <user id="27863"><![CDATA[27863]]></user>
  </uid>
  <created>1389967501</created>
  <changed>1475893616</changed>
  <title><![CDATA[Professor Rao Tummala's Viewpoint on Packaging and System Scaling]]></title>
  <body><![CDATA[<p><strong>Rao R Tummala, Pettit Chair Professor and Director, Georgia Tech</strong></p><p>We started packaging because of the need&nbsp; to test the chips and to connect with other components on the system board to form electronic systems. So transistor scaling, following Moore's Law, was the basis of packaging and &nbsp;all electronics, making &nbsp;electronics the single largest, $1.5T, global industry serving a variety of individual industries that span computing, communications, consumer, automotive and others.</p><p>The basis for this industry is a result of singular focus in transistor scaling, leading to a 5B transistor chip, involving dozens of semiconductor companies around the globe.These chips were packaged mostly as single chips, in which case the value of packaging has been minimal. </p><p>To read more of this viewpoint follow this link: <a href="http://www.semiconductorpackagingnews.com/articles/article_44712.shtml" title="http://www.semiconductorpackagingnews.com/articles/article_44712.shtml">http://www.semiconductorpackagingnews.com/articles/article_44712.shtml</a><br /></p>]]></body>
  <field_article_url>
    <item>
      <url><![CDATA[http://www.semiconductorpackagingnews.com/articles/article_44712.shtml]]></url>
      <title><![CDATA[]]></title>
    </item>
  </field_article_url>
  <field_publication>
    <item>
      <value><![CDATA[ missile destroyer ]]></value>
    </item>
  </field_publication>
  <field_dateline>
    <item>
      <value>2014-01-17</value>
      <timezone></timezone>
    </item>
  </field_dateline>
  <field_media>
        </field_media>
  <og_groups>
          <item>197261</item>
          <item>213791</item>
      </og_groups>
  <og_groups_both>
          <item><![CDATA[Institute for Electronics and Nanotechnology]]></item>
          <item><![CDATA[3D Systems Packaging Research Center]]></item>
      </og_groups_both>
    <field_userdata>
      <![CDATA[]]>
  </field_userdata>
</node>
