{"603941":{"#nid":"603941","#data":{"type":"news","title":"Sarvey Selected for IEEE Best Paper Award","body":[{"value":"\u003Cp\u003ETom Sarvey has been named the recipient of the 2017 Best Paper Award for the\u003Cem\u003E IEEE Transactions on Components, Packaging, and Manufacturing Technology\u003C\/em\u003E in the Components: Characterization and Modeling category. He is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and is a member of the Integrated 3D System (I3DS) Group.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESarvey will be recognized for the paper entitled \u0026quot;Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA\u0026rdquo; at the 2018 IEEE Electronic Components and Technology Conference. The conference will be held May 29-June 1 in San Diego, California.\u0026nbsp;\u0026nbsp; \u0026nbsp; \u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis marks the second time that a member of the I3DS Group has won this particular\u0026nbsp;Best Paper Award. Sarvey\u0026rsquo;s coauthors on the paper are Yang Zhang, an alumnus of the group; ECE Professor Muhannad S. Bakir, who leads the I3DS Group; and Colman Cheung, Ravi Gutala, Arifur Rahman, and Aravind Dasu, all of Intel Corporation\u0026rsquo;s Programmable Solutions Group.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor more than a decade, the challenge of removing the heat from high end computing platforms has been a primary limiter of processor power and computing performance.\u0026nbsp;The use of micro-scale fluidic channels has previously been proposed as a method of extracting the large amounts of heat produced by modern processors.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn this work, such a liquid-cooled heat sink was etched into the backside of a field programmable gate array (FPGA) die, approximately 500 \u0026mu;m from the heat generating circuitry. The heat sink, only 240 \u0026mu;m tall, provided a thermal resistance that is approximately one quarter of that of the best air-cooled heat sinks, in less than 1\/1000\u003Csup\u003Eth\u003C\/sup\u003E of the volume.\u0026nbsp;This type of cooling has the potential to unlock higher computing throughput, lower energy usage, and denser integration in datacenters and high performance computing applications.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student\u0026nbsp;Tom Sarvey has been named the recipient of the 2017 Best Paper Award for the\u003Cem\u003E IEEE Transactions on Components, Packaging, and Manufacturing Technology\u003C\/em\u003E in the Components: Characterization and Modeling category.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student\u00a0Tom Sarvey has been named the recipient of the 2017 Best Paper Award for the IEEE Transactions on Components, Packaging, and Manufacturing Technology in the Components: Characterization and Modeling category. "}],"uid":"27241","created_gmt":"2018-03-17 18:48:51","changed_gmt":"2018-03-17 18:48:51","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-03-17T00:00:00-04:00","iso_date":"2018-03-17T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"311111":{"id":"311111","type":"image","title":"Tom Sarvey","body":null,"created":"1449244726","gmt_created":"2015-12-04 15:58:46","changed":"1475895020","gmt_changed":"2016-10-08 02:50:20","alt":"Tom Sarvey","file":{"fid":"199852","name":"tom_sarvey_0.jpg","image_path":"\/sites\/default\/files\/images\/tom_sarvey_0_0.jpg","image_full_path":"http:\/\/tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/tom_sarvey_0_0.jpg","mime":"image\/jpeg","size":1326337,"path_740":"http:\/\/tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/tom_sarvey_0_0.jpg?itok=EChCcVFj"}}},"media_ids":["311111"],"related_links":[{"url":"http:\/\/www.bakirlab.gatech.edu","title":"Integrated 3D Systems Group"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.ien.gatech.edu","title":"Institute for Electronics and Nanotechnology"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"http:\/\/ieeexplore.ieee.org\/xpl\/RecentIssue.jsp?punumber=5503870","title":"IEEE Transactions on Components, Packaging, and Manufacturing Technology "},{"url":"https:\/\/www.ieee.org\/conferences_events\/conferences\/conferencedetails\/index.html?Conf_ID=32695","title":"2018 IEEE Electronic Components and Technology Conference"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"98611","name":"Tom Sarvey"},{"id":"213","name":"energy"},{"id":"110561","name":"data centers"},{"id":"3427","name":"High performance computing"},{"id":"177450","name":"micro-scale fluidic channels"},{"id":"177451","name":"field programmable gate array"},{"id":"177452","name":"liquid-cooled heat sink"},{"id":"177453","name":"2018 IEEE Electronic Components and Technology Conference"},{"id":"95831","name":"IEEE Transactions on Components"},{"id":"4187","name":"packaging"},{"id":"95841","name":"and Manufacturing Technology"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"109","name":"Georgia Tech"},{"id":"177454","name":"I3DS Group"},{"id":"99661","name":"Muhannad S. Bakir"}],"core_research_areas":[{"id":"39431","name":"Data Engineering and Science"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}