{"662503":{"#nid":"662503","#data":{"type":"news","title":"Buggaveeti Recognized with 2022 Emerging Leader Award in Microelectronics Assembly and Packaging","body":[{"value":"\u003Cp\u003EThe International Microelectronics Assembly and Packaging Society (IMAPS) has recognized Sanketh Buggaveeti with the 2022 Emerging Leader Award. Buggaveeti is currently pursuing an online master\u0026rsquo;s degree in electrical and computer engineering (ECE) at Georgia Tech.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIMAPS\u0026nbsp;is the leading international society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.\u0026nbsp;The IMAPS Emerging Leaders Award\u0026nbsp;recognizes the contributions made by emerging talent with three to eight years in the field and Society membership for a minimum of two years.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAs a principal engineer at Infinera, Buggaveeti leads the design of cutting-edge photonic modules with industry leading levels of mechanical, electrical, thermal, and optical integration. He is an integral part of the optical systems design team that has received five \u0026ldquo;Most Innovative Product\u0026rdquo; industry awards, set over ten performance records, and supported some of the largest telecommunication networks around the world.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBuggaveeti\u0026rsquo;s Georgia Tech research focuses on heterogeneous integration and energy efficient microsystems. He has authored\/co-authored 20 journal and conference papers and currently contributes as a peer reviewer for seven international journals in the fields of microsystems, opto-mechanics, and systems engineering. He was recognized by the U.S. Government as an \u0026ldquo;Outstanding Researcher\u0026rdquo; in 2021 for his contributions in the field of \u0026ldquo;Packaging and Integration of Microsystems\u0026rdquo;.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBuggaveeti holds a Bachelor of Technology degree in mechanical engineering from Vellore Institute of Technology (India) and a master\u0026rsquo;s degree in mechanical engineering from the University of Michigan where he attended as a K.C. Mahindra Scholar and held a graduate research assistantship at the Micro System Technology and Sciences Lab.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Buggaveeti is currently pursuing an online master\u2019s degree in ECE."}],"uid":"36172","created_gmt":"2022-10-24 19:38:51","changed_gmt":"2022-10-25 11:35:45","author":"dwatson71","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2022-10-24T00:00:00-04:00","iso_date":"2022-10-24T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"662502":{"id":"662502","type":"image","title":"Sanketh Buggaveeti is an online master\u2019s degree student in the Georgia Tech School of Electrical and Computer Engineering (ECE).","body":null,"created":"1666640131","gmt_created":"2022-10-24 19:35:31","changed":"1666640131","gmt_changed":"2022-10-24 19:35:31","alt":"Sanketh Buggaveeti is an online master\u2019s degree student in the Georgia Tech School of Electrical and Computer Engineering (ECE).","file":{"fid":"250876","name":"IMG-9490.jpg","image_path":"\/sites\/default\/files\/images\/IMG-9490.jpg","image_full_path":"http:\/\/tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/IMG-9490.jpg","mime":"image\/jpeg","size":516895,"path_740":"http:\/\/tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/IMG-9490.jpg?itok=WHuQ-WFc"}}},"media_ids":["662502"],"related_links":[{"url":"https:\/\/www.imaps.org","title":"International Microelectronics Assembly and Packaging Society (IMAPS)"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42901","name":"Community"},{"id":"42911","name":"Education"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"191515","name":"Sanketh Buggaveeti"},{"id":"191516","name":"International Microelectronics Assembly and Packaging Society (IMAPS)"},{"id":"191517","name":"Infinera"},{"id":"187433","name":"go-ien"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E\u003Cstrong\u003EDan Watson\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Ca href=\u0022mailto:dwatson@ece.gatech.edu\u0022\u003Edwatson@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["dwatson@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}