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  <title><![CDATA[PhD Defense by Nithin J. Nedumthakady]]></title>
  <body><![CDATA[<p>THE SCHOOL OF MATERIALS SCIENCE AND ENGINEERING<br />
GEORGIA INSTITUTE OF TECHNOLOGY<br />
Under the provisions of the regulations for the degree<br />
DOCTOR OF PHILOSOPHY<br />
on Tuesday, January 31st, 2023</p>

<p>11:00 AM<br />
via</p>

<p>Teams</p>

<p><a href="https://teams.microsoft.com/l/meetup-join/19%3ameeting_NDU0MWFjNzEtNWQ4ZC00YjYzLThkZDAtNzg3ODFkMjFmNDEx%40thread.v2/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%226601c060-850a-4925-9bf3-b07f7d7f7982%22%7d">https://teams.microsoft.com/l/meetup-join/19%3ameeting_NDU0MWFjNzEtNWQ4ZC00YjYzLThkZDAtNzg3ODFkMjFmNDEx%40thread.v2/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%226601c060-850a-4925-9bf3-b07f7d7f7982%22%7d</a></p>

<p>will be held the</p>

<p>DISSERTATION PROPOSAL DEFENSE<br />
for<br />
Nithin J. Nedumthakady<br />
&nbsp;<br />
&quot; Magneto-Assisted Electrodeposition of Copper-Graphene Composites: A New Method to Enhance Nanostructure and Properties of Copper in Advanced Packaging&rdquo;</p>

<p><br />
&nbsp;<br />
&nbsp; Committee Members:</p>

<p>Prof. Vanessa Smet, ME (Advisor)<br />
Prof. Rao Tummala, MSE, ECE (Co-Advisor)<br />
Prof. Preet Singh, MSE<br />
Prof. Eric Vogel, MSE<br />
Jobert van Eisden, PhD, MKS Instruments, Inc.</p>

<p>&nbsp;</p>

<p><br />
Abstract:</p>

<p>&nbsp;</p>

<p>The continuous&nbsp;densification of electronic systems has been driving the need for advanced materials with tailorable nanostructures&nbsp;and properties beyond standard electrodeposited copper.&nbsp;Graphene reinforcement of metals has recently gained momentum to not only enhance electrical, thermal, and&nbsp;mechanical properties but also control the metal matrix composites&rsquo; grain structure and its evolution at the nanoscale.&nbsp;Of particular interest, copper-graphene composites have been fabricated by electrodeposition with graphene particles suspended in the&nbsp;copper electrolyte and acting as inert additives. The final composition is thereby mainly governed by the initial volume&nbsp;loading of graphene in the plating bath and any applied agitation methods, giving, so far, limited returns in terms of property improvements. Achieving the theoretical maximum material performance requires 1) a high graphene relative content, 2)&nbsp;homogeneous dispersion of graphene throughout the composite, 3) and controlled alignment of graphene within the material. To address this grand challenge, a novel magneto-electrodeposition process is proposed wherein a low-magnitude magnetic field is applied during the plating. Magnetic fields have different, competing effects on electrodeposition depending on their orientation with respect to the plating current direction: Magnetic fields have different, competing effects on&nbsp;electrodeposition depending on their orientation with respect to the plating current direction: 1) graphene aligns along the&nbsp;magnetic field flux lines owing to its diamagnetic properties; 2) the magnetohydrodynamic (MHD) effect allows for&nbsp;increased, localized agitation and, therefore, more uniform distribution of graphene in the copper matrix, and 3) the magnetic field influences ion&nbsp;movement within the electroplating solution, leading to greater graphene content.&nbsp;</p>

<p>&nbsp;</p>

<p>This research focuses on assessing the effect of applied magnetic fields on electrodeposited copper-graphene&nbsp;composites in terms of their material composition, microstructure, morphology, and subsequent electrical, mechanical, thermal, and thermomechanical properties for use in next-generation advanced packaging. Key results will demonstrate the effects of magnetic fields on graphene, experimental setup, methodology, and proof-of-concept for magneto-electrodeposition of copper-graphene composites, characterization of morphology and mechanical, electrical, and thermal property improvements, theoretical modeling of potential property improvements of graphene-reinforcement of copper, and finite-element modeling to evaluate the potential benefits of copper-graphene composites in advanced packaging applications.</p>

<p>&nbsp;</p>
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